Single Workstation Wire Polishing Machine

Feature
Double pillar structure
Double guide structure guanrantee better vibration straightness

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产品描述

参数

Feature

Double pillar structure

Double guide structure guanrantee better vibration straightness

Specifications

Type	BDXP-G
Processing Scope	Φ0.5～Φ8.0 mm
Die Holder Max.Incline Angle	20°
Power Supply Voltage	AC 220 V，50 Hz
Total Power	＜100 W
Dimension(Length×Width×Height)	600mm×600mm×550mm
Net Weight	About 100kg

Main Features

The driver system uses pulse width modulation technology; Ideally designed for processing fine size;

Double pillar structure with better vertical adjusting capabilities;

High finished grinding basement with better central adjustment capability;

High strength casting structure achieve better performance on stability, precision and service life;

This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

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