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Single Workstation Wire Polishing Machine
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Single Workstation Wire Polishing Machine

Feature
Double pillar structure
Double guide structure guanrantee better vibration straightness
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Feature

Double pillar structure

Double guide structure guanrantee better vibration straightness

 

Specifications

Type

BDXP-G

Processing Scope

Φ0.5~Φ8.0 mm

Die Holder Max.Incline Angle

20°

Power Supply Voltage

AC 220 V,50 Hz

Total Power

<100 W

Dimension(Length×Width×Height)

600mm×600mm×550mm

Net Weight

About 100kg

 

Main Features

The driver system uses pulse width modulation technology; Ideally designed for processing fine size;

Double pillar structure with better vertical adjusting capabilities;

High finished grinding basement with better central adjustment capability;

High strength casting structure achieve better performance on stability, precision and service life;

This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.

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德州国昌机械有限公司

传真:0534-4386188

电话:0534-4386188

马经理:150 5343 2267

邮箱:admin@sdgctools.com

地址:德州市平原县桃园工业园区

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