Semi-automatic Ultrasonic Processing Machine
Function:
☆ Stable ultrasonic energy output
☆ High central stability
☆ Pneumatic lifting
☆ On line grinding needle
☆ Low frequency needle changed
Specifications
Type |
BDSA-CBE200/BDSA-CBE400 |
Recommend Scope |
Φ0.05~Φ2.0mm/Φ0.3~Φ6.0mm |
Needle Length |
120mm |
Ultrasonic Power |
200W/400W |
Ultrasonic Frequency |
20kz |
Power Supply Voltage |
AC 220 V,50 Hz |
Total Power |
<600 W |
Dimension(Length×Width×Height): |
600mm×600 mm×950mm |
Net Weight |
about 150 kg |
Main Features
Built with the latest ultrasonic frequency tracing technology;
Built with redesigned piezoelectric ceramic transducer;
Equipped with needle grinding machine;
High processing speed by fast switching performance between processing and needle grinding position;
Built with pressure monitor on the dies holder, making it easy for operation;
This universal machine is designed for shaping and polishing diamond dies that made from nature diamond, synthetic diamond, industrial ceramics and tungsten carbide.
DMBEST
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